| 摘要 |
<p>A very thin flexible printed circuit membrane (PCM) comprising at least one insulating film 6a, 6b carrying a gold conductor 7 is electrically connected to a photonic integrated circuit (PIC) 1 directly by aligning contacts 3 on the PIC to exposed contact pads on the PCM, which may be exposed through apertures 8 in an insulating layer 6. Gold balls (fig. 3C; 10) may be formed thermo-sonically or by thermo-compression to connect the gold layer to the PIC contact pad. The PCM is an order of magnitude thinner than a conventional PCB. The method overcomes problems associated with wire bonding and flip chip bonding. It is difficult to route electrical connections to the edges of the die for wire bonding to the package (fig. 1), and the density and length of the wires can seriously affect the performance and manufacturability of the device. Indium Phosphide is generally used in PICs which lacks the physical strength of silicon and stresses created by flip chip processing (Fig. 2) can impair performance and reduce the thermal performance.</p> |
