发明名称 |
Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal |
摘要 |
<p>A method of manufacturing a semiconductor device (10A, 10B, 10C) is provided. The method comprises a wire-forming step of forming a wiring (12A, 12B, 12C, 12D) on a substrate (40) having an electrode pad (15) so as to connect the electrode pad to a mounting terminal (14). The wire-forming step includes the steps of: applying a metal foil (25) to the substrate by providing an adhesive (18) therebetween; patterning the metal foil into a predetermined pattern so as to form the wiring; and connecting the wiring to the electrode pad electrically. <IMAGE></p> |
申请公布号 |
EP2261970(A3) |
申请公布日期 |
2012.05.02 |
申请号 |
EP20100180097 |
申请日期 |
2001.06.05 |
申请人 |
FUJITSU SEMICONDUCTOR LIMITED |
发明人 |
AIBA, YOSHITAKA;SATO, MITSUTAKA |
分类号 |
H01L23/485;H01L23/52;H01L21/3205;H01L21/60;H01L23/12;H01L23/31;H01L23/48 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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