| 摘要 |
提供处理包含多个半导体晶粒的半导体晶圆之方法。方法包括提供包含多个半导体晶粒的半导体晶圆，至少部份多个半导体晶粒包含用于测试个别半导体晶粒的接触垫。方法也包含在完成半导体晶圆的晶圆测试之前及在将多个半导体晶粒从半导体晶圆分离之前，将复数个导电凸块设于该接触垫上。至少部份复数个导电凸块配置成在半导体晶圆的晶圆测试期间为电路径。;A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads for testing the respective semiconductor die. The method also includes positioning conductive bumps on the contact pads prior to completing wafer testing of the semiconductor wafer and prior to the singulation of the plurality of semiconductor dies from the semiconductor wafer. At least a portion of the conductive bumps are configured to be electrical paths during wafer testing of the semiconductor wafer. |
