发明名称 Image sensor and method of manufacturing the same
摘要 An image sensor comprises a substrate including a photodiode, and an insulation pattern structure making contact with the photodiode on the substrate. An anti-reflection pattern is formed on the insulation pattern structure and the substrate. The anti-reflection pattern includes a first opening through which the insulation pattern structure is exposed corresponding to the photodiode. A first insulation interlayer structure is formed on the anti-reflection pattern, and the first insulation interlayer structure includes at least one insulation layer and a second opening connected to the first opening. A metal wiring structure is formed in the insulation layer, and a transparent insulation pattern is formed in the first and second openings. A color filter is formed on the transparent insulation pattern, and a micro lens is formed on the color filter.
申请公布号 US8169011(B2) 申请公布日期 2012.05.01
申请号 US20090389831 申请日期 2009.02.20
申请人 OH TAE-SEOK;SAMSUNG ELECTRONICS CO., LTD. 发明人 OH TAE-SEOK
分类号 H01L31/062;H01L31/113 主分类号 H01L31/062
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