发明名称 Method of fabricating single crystal gallium nitride semiconductor substrate, nitride gallium semiconductor substrate and nitride semiconductor epitaxial substrate
摘要 A method of fabricating a single crystal gallium nitride substrate the step of cutting an ingot of single crystal gallium nitride along predetermined planes to make one or more single crystal gallium nitride substrates. The ingot of single crystal gallium nitride is grown by vapor phase epitaxy in a direction of a predetermined axis. Each predetermined plane is inclined to the predetermined axis. Each substrate has a mirror polished primary surface. The primary surface has a first area and a second area. The first area is between an edge of the substrate and a line 3 millimeter away from the edge. The first area surrounds the second area. An axis perpendicular to the primary surface forms an off-angle with c-axis of the substrate. The off-angle takes a minimum value at a first position in the first area of the primary surface.
申请公布号 US8168516(B2) 申请公布日期 2012.05.01
申请号 US20100980923 申请日期 2010.12.29
申请人 UENO MASAKI;SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 UENO MASAKI
分类号 H01L33/00 主分类号 H01L33/00
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