| 摘要 |
<p>The invention relates to a transponder inlay (11) for the production of a layer structure (40) for a personal document having a substrate layer (12) for disposing a transponder unit (15) comprising an antenna coil (13) and a chip module (14), said transponder unit being located on a contact surface (17) of the substrate layer, wherein the chip module (14) is accommodated in a window opening (30) formed in the substrate layer (12) such that a chip carrier (23) of the chip module rests on a compressed edge section (24) of the window opening (30). The invention further relates to a method for producing the transponder inlays. The invention additionally relates to a layer structure for a personal document provided with such a transponder inlay and a passport document comprising such a layer structure.</p> |
