发明名称 |
Co-packaging approach for power converters based on planar devices, structure and method |
摘要 |
A voltage converter includes an output circuit having a high-side device and a low-side device which can be formed on a single die (a “PowerDie”). The high-side device can include a lateral diffused metal oxide semiconductor (LDMOS) while the low-side device can include a planar vertical diffused metal oxide semiconductor (VDMOS). The voltage converter can further include a controller circuit on a different die which can be electrically coupled to, and co-packaged with, the power die. |
申请公布号 |
US8168490(B2) |
申请公布日期 |
2012.05.01 |
申请号 |
US20090470229 |
申请日期 |
2009.05.21 |
申请人 |
HEBERT FRANCOIS;INTERSIL AMERICAS, INC. |
发明人 |
HEBERT FRANCOIS |
分类号 |
H01L21/8238 |
主分类号 |
H01L21/8238 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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