发明名称 |
Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device |
摘要 |
A method of manufacturing a circuit apparatus includes forming a plurality of pierced holes in a metal substrate. A first wiring layer is formed on one side of the metal substrate via a first insulating layer, and a second wiring layer is formed on the other side of the metal substrate via a second insulating layer. A conductor layer is formed in at least some of the plurality of pierced holes to establish a connection between the first wiring layer and the second wiring layer. A circuit element is connected to the first wiring layer on the one side of the metal substrate. When a plurality of pierced holes are formed, protrusions are formed on a surface of the metal substrate at least along either edge of each of the pierced holes provided with the conductor layer to protrude in a convex manner from the surface of the metal substrate.
|
申请公布号 |
US8166643(B2) |
申请公布日期 |
2012.05.01 |
申请号 |
US20100702865 |
申请日期 |
2010.02.09 |
申请人 |
SHIBATA KIYOSHI;USUI RYOSUKE;INOUE YASUNORI;SANYO ELECTRIC CO., LTD. |
发明人 |
SHIBATA KIYOSHI;USUI RYOSUKE;INOUE YASUNORI |
分类号 |
H05K3/36 |
主分类号 |
H05K3/36 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|