发明名称 Flexible Printed Circuits Board and Manufacturing method of the same
摘要 PURPOSE: A flexible printed circuit board and a manufacturing method thereof are provided to prevent the dimension reduction of a circuit by etching a seed layer. CONSTITUTION: A first metal layer is formed on an insulation substrate(S1). A circuit pattern is formed on the insulation substrate(S2). A protection pattern surrounds the circuit pattern(S3). A first metal layer is removed(S4).
申请公布号 KR101139970(B1) 申请公布日期 2012.04.30
申请号 KR20090095839 申请日期 2009.10.08
申请人 发明人
分类号 H05K3/06;H05K3/18 主分类号 H05K3/06
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