发明名称 |
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE |
摘要 |
A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes stacked semiconductor die. In accordance with embodiments, the semiconductor component includes a substrate having a component receiving area and a plurality of bond pads. A semiconductor chip is attached to the component receiving area. An electrical connector is coupled to the semiconductor chip and the substrate. A second semiconductor chip is mounted or attached to one of the ends of the electrical connector such that this end is positioned between the semiconductor chips. A second electrical connector is coupled between the second semiconductor chip and the substrate. A third semiconductor chip is mounted over or attached to the second electrical connector such that a portion is between the second and third semiconductor chips.FIG. 7 |
申请公布号 |
SG179332(A1) |
申请公布日期 |
2012.04.27 |
申请号 |
SG20110054269 |
申请日期 |
2011.07.27 |
申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
SHUTESH KRISHNAN;SOON WEI WANG |
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