SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to improve reliability by offering a material having a lower modulus than that of other material for molding a semiconductor chip and a wiring board between the semiconductor chip and the wiring board. CONSTITUTION: A wiring board has a top connection pad and a lower connection pad. A semiconductor chip(110) has a bonding pad area and an adhesive area excluding the bonding pad area. A bonding pad is electrically connected to the top connection pad. A first molding layer(230) is offered between an adhesive area of the semiconductor chip and a first side of the wiring board. A second molding layer(240) covers the first side of the wiring board and the semiconductor chip and is simultaneously offered between the bonding pad area of the semiconductor chip and the first side of the wiring board.