| 摘要 |
PURPOSE: A method for manufacturing a fan out type wafer level package is provided to secure dimensional stability by forming an adhesive layer which is robust against shear stress. CONSTITUTION: An auxiliary device(1) laminates and fixes an adhesive tape. A carrier(2) supporting the adhesive tape is located under the auxiliary device. The adhesive tape includes a single structure with a die bonding surface adhesive layer(3) on a base film(4) or a double sided structure with the die bonding surface adhesive layer and a carrier surface adhesive layer(5) on both sides of the base film. The inner diameter of the auxiliary device is larger than the outer diameter of the carrier.
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