发明名称 |
PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF |
摘要 |
Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.
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申请公布号 |
US2012097435(A1) |
申请公布日期 |
2012.04.26 |
申请号 |
US201013318058 |
申请日期 |
2010.04.30 |
申请人 |
GOSHIMA TOSHIYUKI;WIN MAW SOE;SEGAWA SIGEMASA;KYO EIKA;PI R&D CO., LTD. |
发明人 |
GOSHIMA TOSHIYUKI;WIN MAW SOE;SEGAWA SIGEMASA;KYO EIKA |
分类号 |
H05K1/03;G03F7/004;G03F7/008;G03F7/022;G03F7/20 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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