MOISTURE-CURABLE REACTIVE HOT-MELT ADHESIVE COMPOSITION

摘要

Provided is a moisture-curable reactive hot-melt adhesive which includes a less toxic polymer having a reactive silicon group and which has the controlled properties of relatively slowly curing at high temperatures (excellent high-temperature storage stability) and of relatively rapidly curing at low temperatures, these properties being inconsistent with each other. The problem can be solved by use of a moisture-curable reactive hot-melt adhesive which comprises a polymer having a reactive silicon group, a resin that is solid at ordinary temperature, and a specific silane coupling agent in combination.