| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor packaging board with less warpage in a state of the semiconductor packaging board itself alone and the board itself in a mounting process. <P>SOLUTION: In a semiconductor packaging board 1, at least one land 14 and a solder resist film 15 are formed at least on one face of a board body 11. The board body 11 includes a cavity part 13, and a resin film 12 of a type different from that of the solder resist film 15, coated and cured at a bottom face 13A of the cavity part 13. The present invention can be applied to a semiconductor packaging board not having a cavity structure. According to the present invention, the resin film of the type different from that of the solder resist film is coated on a part of the board body and cured, and the semiconductor packaging board with at least less warpage of the board body at a certain temperature compared with a state before curing of the resin film can be provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
