| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer flexible substrate having shield properties capable of supporting high speed signal transmission between signal wiring layers, and to provide an electronic apparatus of high operation reliability using the multilayer flexible substrate. <P>SOLUTION: A ground layer 4, an insulation layer 5, and a signal wiring layer 6 in which signal wiring 8 is formed are laminated sequentially in the multilayer flexible substrate 1. The multilayer flexible substrate 1 has a projection 1a projecting laterally, and an earth part 4a conducting electrically to the ground layer 4 is formed on at least one surface of the projection 1a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
