| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board capable of reduction in the thickness while preventing a conductive adhesive material from attaching to another electrode and also provide an electronic apparatus. <P>SOLUTION: A printed wiring board 3 includes a wiring pattern 32 formed on an insulating substrate 31, and a light emitting element 2 mounted thereon through a conductive adhesive material 6, and is used for a light emitting device 1 in which the light emitting element 2 is sealed with resin. The conductive adhesive material 6 is applied to the insulating substrate 31, and the light emitting element 2 is mounted thereon. And thus, a die-connection wiring pattern 324 is conductively connected to the light emitting element 2 through the conductive adhesive material 6. The die-connection wiring pattern 324 is provided between the light emitting element 2 and a wire-connection wiring pattern 323 conductively connected to the light emitting element 2 by a wire 4. Thereby, the printed wiring board 3 can dam the flowing conductive adhesive material 6. A resin sealing part 5 can be reduced in thickness by directly mounting the light emitting element 2 on the insulating substrate 31. <P>COPYRIGHT: (C)2012,JPO&INPIT |
