| 摘要 |
<P>PROBLEM TO BE SOLVED: To satisfy EMI characteristics with electromagnetic noise transmitted from an electronic component to a heat sink when the heat sink is used for cooling the electronic component mounted on an electronic apparatus in which a printed substrate is mounted. <P>SOLUTION: A ground member 1, which prevents electromagnetic noise from transmitting to a heat sink 4, is provided between an electronic component 3 mounted on a printed substrate 6 and the heat sink 4. Further, in order to prevent electromagnetic noise from transmitting from the ground member 1 to the heat sink 4, the ground member 1 is connected to the heat sink 4 through a thermally conductive sheet 2-1 having high resistance. This structure reduces radiation noise from the heat sink 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
