| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of adjusting parallelism and a device of adjusting parallelism for a mounting device, capable of precisely adjusting in a short time the parallelism between a substrate stage and a bonding tool even in the case of mounting a chip component of low pressurizing force. <P>SOLUTION: The device of adjusting parallelism for the mounting device includes a parallelism adjusting part which changes inclination of a bonding tool surface or a substrate stage surface, and drive means for driving the parallelism adjusting part. The device also includes height detecting means for detecting the level of the bonding tool. The method of adjusting parallelism for the mounting device includes a step for pressurizing the bonding tool against the substrate stage at a predetermined pressure, a step in which the drive means changes inclination of the parallelism adjusting part, a step for acquiring the position at the lowest point of the bonding tool based on the information about the height detecting means of the bonding tool while the inclination of the parallelism adjusting part is changed, and a step for holding the inclination position of the parallelism adjusting part when the bonding tool comes to be the lowest point. <P>COPYRIGHT: (C)2012,JPO&INPIT |
