LAMINATE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a laminate manufacturing method capable of suppressing a metal residue from occurring during etching processing and acquiring a laminate having a plating film including patterned copper excellent in linearity and adhesion.

SOLUTION: A manufacturing method of a laminate having a plating film including patterned copper comprises: a polymer layer formation step of bringing a polymer 14 having a functional group forming interaction with a copper ion and a polymerizable group in contact with a substrate 10 and forming a polymer layer by applying energy; a catalyst application step of bringing a plating catalyst liquid including the copper ion and exceeding pH3.0 in contact with the polymer layer and applying the copper ion to the polymer layer; a first alkaline aqueous solution contact step of bringing the polymer layer to which the copper ion was applied in contact with an alkaline aqueous solution; a plating step of applying at least copper plating to the polymer layer and acquiring a plating film 16 including copper; and a pattern formation step of etching the plating film including the copper into a pattern shape and forming a plating film 18 including the patterned copper.

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