| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection structure of an electrode of which supplied solder can be easily observed from the outside. <P>SOLUTION: A connection structure of an electrode comprises a power module Mp, an upper electrode 20, and solder 30 and 31. The upper electrode 20 is disposed above the top surface of a semiconductor element 11 of the power module Mp with an interval (distance d1) from the top surface. Additionally, the upper electrode 20 has notches 21 and 22, and is disposed at the position where the semiconductor element 11 of the power module Mp can be seen from above through the notches 21 and 22. The semiconductor element 11 of the power module Mp and the upper electrode 20 are bonded by the solder 30 and 31 supplied to the notches 21 and 22. <P>COPYRIGHT: (C)2012,JPO&INPIT |
