| 摘要 |
<p>PURPOSE: A stacked semiconductor package and a manufacturing method thereof are provided to simplify wiring and a manufacturing process by mounting a semiconductor die on a wiring board to be exposed. CONSTITUTION: A cavity(118) is formed on an upper side of a first wiring board(110). A first semiconductor die(120) is mounted on the cavity to face-up. A top package includes a second semiconductor die(220), a second wiring board, and a molding unit(240). The top package is laminated to be electrically connected to the first wiring board and the first semiconductor die. A passive device is built in the first wiring board.</p> |
