发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device with an improved pinch-off characteristic or an improved channel layer mobility and having good electrical characteristics. <P>SOLUTION: A method of manufacturing a semiconductor device includes the following steps of: forming a GaN-system semiconductor layer 20 on a substrate 10; forming an opening 28 on the GaN-system semiconductor layer; forming an electron transit layer 22 and an electron supply layer 26 on a lateral face of the opening; forming a gate electrode 32 on a lateral face of the electron supply layer on the opening side; forming a source electrode 30 on the GaN-system semiconductor layer; and forming a drain electrode 34 connected with a surface opposite to the source electrode of the GaN-system semiconductor layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012084901(A) |
申请公布日期 |
2012.04.26 |
申请号 |
JP20110266051 |
申请日期 |
2011.12.05 |
申请人 |
SUMITOMO ELECTRIC DEVICE INNOVATIONS INC |
发明人 |
NAKADA TAKESHI;KAWASAKI TAKESHI;YAEGASHI SEIJI |
分类号 |
H01L29/80;H01L21/205;H01L21/336;H01L21/338;H01L29/12;H01L29/778;H01L29/78;H01L29/812 |
主分类号 |
H01L29/80 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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