| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat treatment method and a heat treatment apparatus which can enhance throughput by shortening the time required for pretreatment of film formation processing. <P>SOLUTION: A substrate W is conveyed to a flash bake unit FLB before an antireflection film is formed thereon. Surface of the substrate W held on the upper surface of a cooling plate 81 is irradiated with flash light from a flash lamp FL and heated instantaneously, thus drying moisture adhering to the surface of the substrate W. After reducing the pressure in a chamber 70 subsequently, vapor of hexamethyldisilazane (HMDS) is sprayed, and adhesion enhancement processing of the surface of the substrate W is performed by conducting flash light irradiation again in the vapor atmosphere of hexamethyldisilazane. Since flash heating treatment by the flash light irradiation is a treatment with an extremely short time of 1 sec. or less, throughput can be enhanced by shortening the time required for pretreatment of film formation processing. <P>COPYRIGHT: (C)2012,JPO&INPIT |
