发明名称 PHOTOCURING COMPOSITION FOR PRESSURE SENSITIVE ADHESIVE AND DICING DIE BONDING FILM COMPRISING THE SAME
摘要 PURPOSE: A photo-curable adhesive composition is provided to reduce delamination force of adhesive layers after UV hardening by including a UV-curable acrylate having a hydroxyl group and a vinyl group at the same time. CONSTITUTION: A photo-curable adhesive composition comprises UV-curable acrylate including a hydroxyl group and vinyl group 3-50 parts by weight, thermosetting material 0.5-5 parts by weight, and photopolymerization initiator 0.1-3 parts by weight based on 100.0 parts by weight of an acrylic adhesive binder including the vinyl group. The acrylic adhesive binder includes an acrylic monomer, a hydroxyl monomer, and an epoxy monomer. A dicing film includes a base film(100) and an adhesive layer which is formed on the base film.
申请公布号 KR101138793(B1) 申请公布日期 2012.04.26
申请号 KR20080126166 申请日期 2008.12.11
申请人 发明人
分类号 C09J133/08 主分类号 C09J133/08
代理机构 代理人
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