OPTICAL PACKAGE COMPRISING DIRECT FORMED INSULATING LAYER WITHOUT ADHESIVE AND METHOD FOR FORMING INSULATING LAYER

摘要

PURPOSE: An optical package for including an insulating layer directly formed without an adhesive and a method for forming an insulating layer are provided to produce a large sized substrate by performing a process using a copper thin film layer as a support layer. CONSTITUTION: The powder of an insulating material is sprayed on a metal layer(210) in a high speed spraying method. The powder of a sprayed insulating material is thermally treated at room temperature and low temperatures below 300 °C. The paste of the insulating material is deposited on the insulating layer by using a screen printing method. A deposited insulating layer is thermally treated at low temperatures of 180°C to 450°C.