发明名称 CIRCUIT FORMATION METHOD USING LASER
摘要 <P>PROBLEM TO BE SOLVED: To provide a circuit formation method using a laser. <P>SOLUTION: In the circuit formation method using a laser, a photographic sensitive material is applied on a substrate to form a photographic sensitive material layer, and the photographic sensitive material layer is exposed to the laser using a patterning method. A substrate having an exposed region and an unexposed region is put into a nano conductive metal solution, and absorbs nano metal particles on the photographic sensitive material in the exposed region by a linear molecular structure of the photographic sensitive material in the exposed region, and forms a metal circuit layer on the photographic sensitive material. Use of a laser radiation method can efficiently control product quality owing to high power, high density, high directivity and monochromaticity of the laser. In addition, the pattern-exposed photographic sensitive material absorbs the metal particles and forms the metal circuit layer, which reduces waste fluid efficiently and coincides with modern idea of environmental protection. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012084652(A) 申请公布日期 2012.04.26
申请号 JP20100228569 申请日期 2010.10.08
申请人 CRETEC CO LTD 发明人 HE JIAN-HAN;HUANG HUAMIN
分类号 H05K3/10;H05K3/00 主分类号 H05K3/10
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