| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate heater which reduces the height of the heater and cooling time. <P>SOLUTION: A substrate heater 1 comprises: a heater plate 2 on which a wafer W is placed; a heater electrode 3 provided at a lower surface of the heater plater 2; a buffer plate 4 having a coefficient of thermal conductivity which is equivalent to that of the heater plate 2; a cooling plate 5; and multiple pistons 6. A first space S1 of a clearance d1 is defined between the buffer plate 4 and the heater plate 2. Further, the cooling plate 5 is assembled to multiple shafts 42 supporting the buffer plate 4 so as to move up and down. A piston rod 61 allows the cooling plate 5 to be positioned below the buffer plate 4 and forms a space S2 of a clearance d2 between the buffer plate 4 and the cooling plate 5. Further, the pistons 6 move up the cooling plate 5 and allow the cooling plate 5 to come in contact with the buffer plate 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
