发明名称 POLISHING PAD, MANUFACTURING METHOD THEREOF AND POLISHING METHOD
摘要 A polishing pad capable of improving an affinity to polishing liquid and stabilizing polishing performance is provided. A polishing pad 10 is equipped with a urethane sheet 2. The urethane sheet 2 has a polishing surface P for polishing an object to be polished. The urethane sheet 2 is formed by a dry molding method and is formed by slicing a polyurethane foamed body which is obtained by reacting and curing mixed liquid in which an isocyanate-group containing compound, water, a foam control agent and a polyamine compound are mixed. Foams 3 are dispersed approximately uniformly inside the urethane sheet 2. Opened pores 4 which are opened parts of the foams 3 are formed at the polishing surface P. Inside the urethane sheet 2, the foams 3 formed adjacently to each other are communicated by communication holes 9, and the communication holes 9 are formed at a ratio of 800 holes/cm2 or more when observed from a side of the polishing surface P. Polishing liquid moves via the communication holes 9 and the foams 3.
申请公布号 US2012100783(A1) 申请公布日期 2012.04.26
申请号 US201013379588 申请日期 2010.06.22
申请人 ITOYAMA KOHKI;TAKAHASHI DAISUKE;UENO JUNICHI;KOBAYASHI SYUICHI;SHIN-ETSU HANDOTAI CO., LTD.;FUJIBO HOLDINGS INC. 发明人 ITOYAMA KOHKI;TAKAHASHI DAISUKE;UENO JUNICHI;KOBAYASHI SYUICHI
分类号 B24B1/00;B24B37/24;B24D11/00;B24D18/00;H01L21/304 主分类号 B24B1/00
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