| 发明名称 |
POLISHING PAD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad capable of not only executing highly accurate polish finishing which requires extremely high smoothness and flatness but also improving polishing efficiently much higher than a conventional pad. <P>SOLUTION: The polishing pad polishes an article to be processed by relatively moving an article relative to itself while supplying a slurry containing a polishing material between the article and itself. A polishing pad base material which is an epoxy resin and has a hardness (JIS-A) of 70 to 100° is used. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012081566(A) |
申请公布日期 |
2012.04.26 |
| 申请号 |
JP20100231000 |
申请日期 |
2010.10.13 |
| 申请人 |
RITSUMEIKAN;KOKONOE DENKI KK |
发明人 |
TANI YASUHIRO;NOMURA NOBUYUKI |
| 分类号 |
B24B37/24;B24B37/20;B24B37/26;B24D3/32;B24D7/00;H01L21/304 |
主分类号 |
B24B37/24 |
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