| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pad for polishing a substrate. <P>SOLUTION: There is disclosed an improved polishing pad for polishing semi-conductors and other planar substrates in the presence of slurry which optionally may contain abrasive particles. The polishing pad includes a non-woven fibrous component the portion of which may optionally include bicomponent fibers, and which is optionally embedded in a polymer matrix component. The invention also relates to a method of manufacturing the polishing pad. In particular, the method includes: a step of combining a needle-punched non-woven textile at least the portion of which or the whole of which may include bicomponent fibers with a polymeric binder to a desired level; and a step of forming a thin sheet under heat and pressure and surface finishing is performed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
