| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide core shell type fine particles which can be used for manufacturing a semiconductor device in a wet process such as coating, have adequate electrical characteristics and can be inexpensively manufactured. <P>SOLUTION: In the core shell semiconductor fine particles with a particle size of 0.01-1 μm which include core particles and a shell that covers at least a part of the surface of the core particles, the core particles are formed of at least one metal oxide (A) having a band gap of 3 eV or more, and the shell is formed of at least one metal oxide (B). <P>COPYRIGHT: (C)2012,JPO&INPIT |
