| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser processing apparatus which has high laser irradiation efficiency and can reduce processing time with a simple structure using only a processing beam without the use of a sub-beam. <P>SOLUTION: A laser processing apparatus comprises: a laser oscillator 1 which generates laser light; a laser optical system 6 for irradiating a workpiece W with the laser light from the laser oscillator 1; a stage 7 for moving the laser light and the workpiece relative to each other; a light intensity measuring device 11 for measuring the intensity of light reflected from the workpiece W during the irradiation of laser light; and a control unit 12 for controlling the operation of the stage 7. While processing the workpiece W, the control unit 12 controls a relative movement path of the laser light and the workpiece W based on the intensity of reflected light measured by the light intensity measuring device 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
