| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate structure which improves the reliability of a substrate. <P>SOLUTION: A substrate structure comprises: a first metal substrate; a second metal substrate; a frame jig; a first conductive layer; a second conductive layer; a first adhesion layer; and a second adhesion layer. The second metal substrate is stacked on the first metal substrate. The frame jig is disposed around the first metal substrate and the second metal substrate. The first adhesion layer is disposed between the first conductive layer and the first metal substrate and between the first conductive layer and the frame jig. The first conductive layer is fixed to an upper surface of the frame jig with the first adhesive layer. The second adhesion layer is disposed between the second conductive layer and the second metal substrate and between the second conductive layer and the frame jig. The second conductive layer is fixed to a lower surface of the frame jib with the second adhesive layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
