| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a simple bonding method of a package component capable of ensuring bonding strength between a package component having solder balls and a mounting circuit board. <P>SOLUTION: The bonding method of a package component where a package component having solder balls is bonded to a mounting circuit board includes a film formation step for forming a resin composition film composed of a thermosetting resin composition and having a thickness of 20-90% of the height of the solder ball, a resin composition adhesion step for making the thermosetting resin composition 31 adhere to the solder ball by immersing the solder ball 11 of the package component 1 into the resin composition film, a mounting step for mounting the package component to which the thermosetting resin composition is adhering on the bonding land 21 of the mounting circuit board, and a reflow step. <P>COPYRIGHT: (C)2012,JPO&INPIT |
