| 摘要 |
<P>PROBLEM TO BE SOLVED: To materialize a highly sensitive pattern inspection by reducing an influence of brightness unevenness in a pattern generated by a difference in film thickness, in a pattern inspection device comparing images of areas corresponding to two patterns formed to have the same pattern and determining a disagreement portion of the images as a defect, and to materialize the pattern inspection device which can manifest various defects and be applied to a wide range of processes. <P>SOLUTION: A pattern inspection device comparing images of areas corresponding to two patterns formed to have the same pattern and determining a disagreement portion of the images as a defect, comprises a plurality of detection systems and a plurality of image comparing processing methods corresponding to the plurality of detection systems. The pattern inspection device also comprises means for converting the gradation of an image signal between compared images by a plurality of different processing units. Consequently, a defect can be accurately detected even if the difference in brightness is generated in the same pattern between the images. <P>COPYRIGHT: (C)2012,JPO&INPIT |
