| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing device capable of efficiently processing even a hard brittle substrate such as a sapphire substrate to a desired thickness, and performing processing without causing strain in the hard brittle substrate. <P>SOLUTION: In this processing device including a lathe-turning unit 3 having a turning tool 33 for lathe-turning a surface W1 of a processing object W held to a holding unit 2, a laser irradiation unit 4 to irradiate a laser beam to a region of the processing object W to be lathe-turned by the turning tool 33 is arranged. Even when the processing object W is a hard brittle substrate such as a sapphire substrate, a laser beam 4a is irradiated before lathe-turning, thereby the irradiated part becomes flexible to expand a ductile part, and lathe-turning by the lathe-turning tool 33 is allowed, so that lathe-turning can be efficiently performed like lathe-turning a metal. <P>COPYRIGHT: (C)2012,JPO&INPIT |
