发明名称 EDGE TERMINATION STRUCTURE FOR SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To neutralize adverse effect of the boundary surface charges in an insulation layer such as an oxide film in an edge termination structure for a silicon carbide device, and to reduce or eliminate the impact on the change of oxide film charges in a multiple floating guard ring termination. <P>SOLUTION: An edge termination structure for a silicon carbide device has a plurality of concentric circle floating guard rings in a silicon carbide layer, the floating guard rings neighboring to and being spaced apart from a silicon carbide-based semiconductor junction. An insulation layer such as an oxide film is provided on these floating guard rings, and a silicon carbide surface charge compensation region is provided between these floating guard rings and is adjacent to the insulation layer. A method of fabricating the edge termination structure is also provided. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012084910(A) 申请公布日期 2012.04.26
申请号 JP20110276103 申请日期 2011.12.16
申请人 CREE INC 发明人 RYU SI HOON;ANANTO K AGARWAL
分类号 H01L29/06;H01L29/24;H01L29/47;H01L29/861;H01L29/872 主分类号 H01L29/06
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