| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wet cleaning method of a substrate which allows for efficient removal of pollution by foreign matters such as particles adhering to the substrate, and which allows for improvement in the yield of a product such as a semiconductor device. <P>SOLUTION: When a wafer is cleaned by applying ultrasonic wave to a cleaning chemical, an arrangement direction of the wafer in the cleaning fluid for maximizing the cleaning efficiency is determined based on the distribution of the number of particles adhering onto the wafer before cleaning in the substrate, and the sound pressure distribution in an ultrasonic cleaning tank. The arrangement direction of the wafer thus determined is set for a wafer to be cleaned, and cleaning is performed while maintaining that arrangement direction in the cleaning fluid. <P>COPYRIGHT: (C)2012,JPO&INPIT |
