发明名称 HEAT EXCHANGER FOR DOUBLE SIDE COOLING OF SEMICONDUCTOR
摘要 <P>PROBLEM TO BE SOLVED: To solve such a problem of a double side cooling semiconductor device that it requires a large number of components including a contractible part in the shape of a bellows, a presser plate for compressing in the lamination direction, through bolts and nuts, and thereby the structure is complicated, and to provide a highly versatile heat exchanger for double side cooling of a semiconductor. <P>SOLUTION: The heat exchanger for double side cooling of a semiconductor has first and second flat elements 1, 2 which internally conduct fluid for cooling and are coupled while facing the planes each other. A pair of connection pipes 3, 4 are projected from each end of each flat element 1, 2 while facing each other. The outer periphery of the connection pipes 3, 4 are threaded 5, 6 reversely to each other and a connection nut 7 is screwed therebetween. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012084704(A) 申请公布日期 2012.04.26
申请号 JP20100230146 申请日期 2010.10.13
申请人 T RAD CO LTD 发明人 FUJISHIMA SHIRO
分类号 H01L23/40;H01L23/473 主分类号 H01L23/40
代理机构 代理人
主权项
地址