| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board which is capable of increasing conduction reliability between conductive layers connected via a conductive material filling a through-hole. <P>SOLUTION: A printed wiring board 1 according to the present invention comprises: a first conductive layer 3; a second conductive layer 4; an insulating layer 5 disposed between the first and second conductive layers 3 and 4 and having a through-hole 5a which reaches the first and second conductive layers 3 and 4; and a conductive material 6 filling the through-hole 5a and electrically connecting the first and second conductive layers 3 and 4. The conductive material 6 contains a plurality of conductive particles 11 and a resin 12. Each of the conductive particles 11 comprises a resin particle and a copper layer provided on the surface of the resin particle. <P>COPYRIGHT: (C)2012,JPO&INPIT |
