| 摘要 |
A substrate for chip packaging includes a laminated board made of a plurality of ferrite sheets and a coil component disposed on the board. The coil component includes a first coil conductor, a second coil conductor, and a first via-hole conductor. The first coil conductor is disposed on a surface of a first sheet of the board. The second coil conductor is disposed on a surface of a second sheet of the board. The first via-hole conductor includes a first through hole formed at the first sheet and a first conductor filled in the first through hole. The substrate further includes a top surface having a plurality of first conductive pads, and a bottom surface having a plurality of second conductive pads. Each of the first conductive pads is electrically connected with each of the second conductive pads.
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