ELECTROLESS NICKEL PLATING BATH AND ELECTROLESS NICKEL PLATING METHOD USING SAME
摘要
An electroless nickel plating bath that contains a nickel salt, a reducing agent, a stabilizer that contains metal antimony or an antimony compound, and a complexing agent that contains succinic acid or one of malic acid and lactic acid at a chelate molar ratio of 25:75 to 75:25.
申请公布号
WO2012052832(A2)
申请公布日期
2012.04.26
申请号
WO2011IB02514
申请日期
2011.10.21
申请人
TOYOTA JIDOSHA KABUSHIKI KAISHA;KANTO GAKUIN UNIVERSITY;BESSHO, TAKESHI;HONMA, HIDEO;WATANABE, MITSUHIRO;TASHIRO, KATSUHIKO
