发明名称 METHOD OF MANUFACTURING LENS FOR LIGHT EMITTING DIODE PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a lens for a light emitting diode package which is capable of reducing a manufacture cost through reduction of material loss and improving productivity through a simple process without requiring additional equipment investment by freely materializing a final lens shape by curing liquid resin in multi-steps. <P>SOLUTION: The method of manufacturing a lens for a light emitting diode package includes steps of: preparing a substrate 110 mounting a light emitting chip 130; forming a temporarily cured resin covering the light emitting chip 130 on the substrate 110; and curing the temporarily cured resin into a shape of a lens 150b. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012084899(A) 申请公布日期 2012.04.26
申请号 JP20110250365 申请日期 2011.11.16
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人
分类号 H01L33/54;B29C43/18;B29K101/10;B29L31/34;G02B3/00;H01L33/58 主分类号 H01L33/54
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