| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder ball adsorption jig. <P>SOLUTION: Since a conductive thin film is inserted to a jig so that an electric sensor structure is applied, an electrical detecting is enabled, and it is not necessary to confirm if a missing ball occurs or an abnormal solder ball (large ball/small ball/ball size) is adsorbed in every detail with image (vision). Therefore, working hours can be shortened and working efficiency can be improved because of the solder ball adsorption jig of this invention. <P>COPYRIGHT: (C)2012,JPO&INPIT |
