| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation sheet of electronic equipment in which the heat dissipation sheet is installed flat without warping even when, around an electronic component on which the heat dissipation sheet is provided, another electronic component taller than the electronic component is placed. <P>SOLUTION: A heat dissipation sheet S2 is provided with insulation coating layers 12 made of polyimide or the like on the front and reverse sides of a heat conductive layer 11 made of a metallic material such as a copper foil. A recess H is formed at a position corresponding to the other tall electronic component 1a in this heat dissipation sheet so that the tall electronic component is fit into the recess and this does not affect the installation direction of the heat dissipation sheet. By doing so, the heat dissipation sheet can be installed flat (in parallel) along a circuit board 2 regardless of the other tall electronic component. Such flat installation can realize the configuration in which the heat dissipation sheet does not touch a component opposite to the circuit board to be placed between both of them or is brought into close contact with and along a reverse side of the component. The recess is formed by employing means of a through-hole, cut 21, cut-and-raised portion, or the like. <P>COPYRIGHT: (C)2012,JPO&INPIT |
