| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve an electrical symmetric property without increasing the occupied area of an on-chip inductor. <P>SOLUTION: In an on-chip inductor formed by metal wiring on a semiconductor substrate, the inductor is formed by the series connection of n turns of round wiring, and bypass wiring connecting the different round wiring is provided so as to reduce impedance difference in an input output end, thereby replacing the wiring order of inductor rounds as appropriate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
