SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME

摘要

A semiconductor device is provided with: a chip mount member (102) having a terminal pad (123a); a semiconductor chip (101) mounted on the chip mount member (102) and having a chip pad (112); and a metallic ribbon (104) connecting the chip pad (112) and the terminal pad (123a). The metallic ribbon (104) has a first surface (104a) joined to the chip pad (102), and a second surface (1204b) on the opposite side to the first surface (104a) and joined to the terminal pad (123a). The metallic ribbon (104) extends from the joined portion of the first surface (104a) and the chip pad (223) in the opposite direction of the base (102), and is inverted above the semiconductor chip (101) so that the second surface (104b) makes contact with the upper surface of the base (102).