发明名称 |
Semiconductor Devices and Methods of Manufacture Thereof |
摘要 |
Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base member is coupled to an end of the plurality of first parallel conductive members, and a second base member is coupled to an end of the plurality of second parallel conductive members. A connecting member is disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member includes at least one elongated via. |
申请公布号 |
US2012099243(A1) |
申请公布日期 |
2012.04.26 |
申请号 |
US201213344714 |
申请日期 |
2012.01.06 |
申请人 |
BARTH HANS-JOACHIM;RUDERER ERWIN;VON GLASOW ALEXANDER;RIESS PHILIPP;KALTALIOGLU ERDEM;BAUMGARTNER PETER;BENETIK THOMAS;TEWS HELMUT HORST;INFINEON TECHNOLOGIES AG |
发明人 |
BARTH HANS-JOACHIM;RUDERER ERWIN;VON GLASOW ALEXANDER;RIESS PHILIPP;KALTALIOGLU ERDEM;BAUMGARTNER PETER;BENETIK THOMAS;TEWS HELMUT HORST |
分类号 |
H01G4/005 |
主分类号 |
H01G4/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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