METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURED USING SAME, METHOD FOR MANUFACTURING ELECTRIC/ELECTRONIC COMPONENT, AND ELECTRIC/ELECTRONIC COMPONENT MANUFACTURED USING SAME

摘要

A WLCSP electronic device having a COW structure can be manufactured as follows: with the functional surface of a semiconductor wafer supported by a first support substrate with a first anchor resin layer interposed therebetween, the back side of the semiconductor wafer is processed, and then with the back side of the semiconductor wafer supported by a second support substrate with a second anchor resin layer interposed therebetween, a semiconductor device is mounted.